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 Tel: 886-2-66296288 Fax: 886-2-29174598 URL: http://www.princeton.com.tw
2.5W x 2 Class AB Audio Power Amplifier
PT2305
EDESCRIPTION
The PT2305 is an audio power amplifier utilizing CMOS Technology specially designed for audio purpose. It can deliver 2.5W x 2 power output to the 4 load. The power consumption is very low in stand-by. Total harmonic distortion is lower than 0.03%. The output structure is BTL (Bridge-Tied Load) mode for driving speaker load mode. Built-in over-temperature protection, package size is not occupies PCB space. It is suitable for small or portable products.
FEATURES
* * * * * * * CMOS technology Operating voltage: 2.7V ~ 6V Output power 2.5W x 2 (4/10%THD) Built-in 31 steps volume controller Suppress the pop and click noise when mode changed Extreme low current consumption in Shutdown mode (Icc<0.7A) Built-in over temperature protection
APPLICATIONS
* * * * LCD monitor or TV Portable audio Multimedia speakers Other audio applications
PT2305 V1.1
-1-
May, 2005
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2.5W x 2 Class AB Audio Power Amplifier
PT2305
BLOCK DIAGRAM
Mute Mute C ontrol 10K 10K
DC_Vo1
Vin2 Vo2 Shutdown VD D GND
+ -
Power Management Click and P op S uppression Circuitry 10K
Bypass
PT2305 V1.1
-
Vin1
+ Bias Volume C ontrol 31 steps Bias
20K + -
20K -OUT2
10K
-2-
-
Vo 1
+ 20K 20K + + -
-OUT1
+OUT 1
+OUT 2
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2.5W x 2 Class AB Audio Power Amplifier
PT2305
PIN CONFIGURATION
Bypass GND -Out 1 VD D +Out 1 GND Shutdown Mute VD D DC_Vol 1 2 3 4 5 6 7 8 9 10 20 19 18 17 GND GND -OUT 2 VD D +Out 2 GND Vo 2 Vin 2 Vin 1 Vo 1
P T 23 0 5
16 15 14 13 12 11
PIN DESCRIPTION
Pin Name Bypass GND -OUT1 VDD +OUT1 Shutdown Mute DC_Vol Vo1 Vin1 Vin2 Vo2 +OUT2 -OUT2 I/O Description O Internal bias reference bypassing Ground O Channel 1 Output (-) Power Supply Input O Channel 1 Output (+) Shutdown pinEntire IC into the shutdown mode when this I pin connected to the VDD I Mute Pin, Output muted when it connected to VDD I DC Volume control input pin I Channel 1 output for external feedback circuit I Channel 1 audio input I Channel audio input I Channel 2 output for external feedback circuit O Channel 2 Output (+) O Channel 2 Output (-) Pin No. 1 2, 6, 15, 19, 20 3 4, 9, 17 5 7 8 10 11 12 13 14 16 18
PT2305 V1.1
-3-
May, 2005
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2.5W x 2 Class AB Audio Power Amplifier
PT2305
FUNCTION DESCRIPTION
POWER SUPPLY
The operating voltage of PT2305 is from 2.7V to 6V, In general operation 5V is recommended. When the supply voltage less then 3V the IC can work properly, but the distortion reading will rise. After the supply voltage over 6.5V, the higher stand-by current consumption will rising the temperature on chip surface
SHUTDOWN
When the DC supply still powered the chip Vcc, pull-up the shutdown pin to the Vcc level will take the chip into the shutdown mode. After the shutdown mode is active the total current consumption is less than 0.7A. and the all of input or output pins no voltage outputWhen shutdown pin set to GND, the IC is back to the normal operation. Shutdown Pin VDD GND Output State Shutdown ON Normal
MUTE
When the mute pin is connected to the VDD all of outputs signal will be muted immediately, otherwise connected to the GND the IC is back to the normal operation. Mute Pin VDD GND Output State Mute ON Normal
INPUT GAIN ADJUST
The input gain of the PT2305 can be adjust by the external resistor, in normal operation 0dB gain setting is recommended, please refer to the application circuit. If the source output level is not so high (ex: < 2Vpp), increase the input gain can get the higher volume. The minimum value of the input series resistance is 10K for the modest input impedance. To make sure the input stage will not be distortion by overload, please confirm the input signal level, for the gain set please refer to the following table: Operating Voltage VDD=3V VDD=5V Input Gain=-6dB Vin <5Vpp Vin <8Vpp Input Gain=0dB Vin <2.5Vpp Vin<4Vpp Input Gain=+6dB Vin <1.25Vpp Vin<2Vpp
OVER TEMPERATURE PROTECTION
The PT2305 has a built-in over temperature protection circuit, it will turn off all power output when the chip temperature over 150, ,the chip will return to normal operation automatically after the temperature cool down to 105.
PT2305 V1.1 -4May, 2005
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2.5W x 2 Class AB Audio Power Amplifier
PT2305
POP AND CLICK SURPPRESS
A power amplifier uses single supply voltage may almost have noise on output in the power-on period. It is because of the output DC potential needs time to stable on 1/2Vcc, the period relative with the capacitance on the Bypass pin. Higher CB value will extend the stable time, and also can suppress the noise when power-on. In supply voltage=5V and CB=1F, stable time is about 200mS The value of CB also relative with the value of the DC blocking capacitor connected in input terminal. In general condition the time constant of DC blocking capacitor should be less than CB stable time. Recommend parts values please refer to application circuit. CB and delay time, please refer to following table: CB 0.01uF 0.1uF 0.22uF 0.47uF 1.0uF TON 2ms 20ms 44ms 94ms 200ms
VOLUME CONTROLLER
The PT2305 has a built-in 31 steps volume controller, output volume is determinate by voltage applied at the DC Vol pin. Range is from 0dB ~ -75dB. The lower DC voltage is means more volume attenuation. The attenuation levels are -1dB/step from 0dB ~ -6dB, -2dB/step from -6dB ~ -36dB, -3dB/step from -36dB ~ -47dB, -4dB/step from -47dB ~ -51dB, -5dB/step from -51dB ~ -66dB and -12dB/step to the last step at -78dB. About relation between the volume setup and DC Vol, please refer to the following table.
PT2305 V1.1
-5-
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2.5W x 2 Class AB Audio Power Amplifier
PT2305
Voltage Range (VDD=3V) Low High Recommended 2.325 3.000 3.000 2.250 2.363 2.306 2.175 2.288 2.231 2.100 2.213 2.156 2.025 2.138 2.081 1.950 2.063 2.006 1.875 1.988 1.931 1.800 1.913 1.856 1.725 1.838 1.781 1.650 1.763 1.706 1.575 1.688 1.631 1.500 1.613 1.556 1.425 1.538 1.481 1.350 1.463 1.406 1.275 1.388 1.331 1.200 1.313 1.256 1.125 1.238 1.181 1.050 1.163 1.106 0.975 1.088 1.031 0.900 1.013 0.956 0.825 0.937 0.881 0.750 0.862 0.806 0.675 0.787 0.731 0.600 0.712 0.656 0.525 0.637 0.581 0.450 0.562 0.506 0.375 0.487 0.431 0.300 0.412 0.356 0.225 0.337 0.281 0.150 0.262 0.206 0.000 0.187 0.000
VOLUME CONTROL TABLE
Step 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 Gain (dB) 0 -1 -2 -3 -4 -5 -6 -8 -10 -12 -14 -16 -18 -20 -22 -24 -26 -28 -30 -32 -34 -36 -39 -42 -45 -47 -51 -56 -61 -66 -78 Voltage Range (%VDD) Low High Recommended 77.5 % 100.00 % 100.000% 75.0 % 78.5 % 76.875 % 72.5 % 76.25 % 74.375 % 70.0 % 73.75 % 71.875 % 67.5 % 71.25 % 69.375 % 65.0 % 68.75 % 66.875 % 62.5 % 66.25 % 64.375 % 60.5 % 63.75 % 61.875 % 57.5 % 61.25 % 59.375 % 55.0 % 58.75 % 56.875 % 52.5 % 56.25 % 54.375 % 50.0 % 53.75 % 51.875 % 47.5 % 51.25 % 49.375 % 45.0 % 48.75 % 46.875 % 42.5 % 46.25 % 44.375 % 40.0 % 43.75 % 41.875 % 37.5 % 41.25 % 39.375 % 35.0 % 38.75 % 36.875 % 32.5 % 36.25 % 34.375 % 30.0 % 33.75 % 31.875 % 27.5 % 31.25 % 29.375 % 25.0 % 28.75 % 26.875 % 22.5 % 26.25 % 24.375 % 20.0 % 23.75 % 21.875 % 17.5 % 21.25 % 19.375 % 15.0 % 18.75 % 16.875 % 12.5 % 16.25 % 14.375 % 10.0 % 13.75 % 11.875 % 7.5 % 11.25 % 9.375 % 5.0 % 8.75 % 6.875 % 0.0 % 6.25 % 0.000 % Voltage Range (VDD=5V) Low High Recommended 3.875 5.000 5.000 3.750 3.938 3.844 3.625 3.813 3.719 3.500 3.688 3.594 3.375 3.563 3.469 3.250 3.438 3.344 3.125 3.313 3.219 3.000 3.188 3.094 2.875 3.063 2.969 2.750 2.938 2.844 2.625 2.813 2.719 2.500 2.688 2.594 2.375 2.563 2.469 2.250 2.438 2.344 2.125 2.313 2.219 2.000 2.188 2.094 1.875 2.063 1.969 1.750 1.938 1.844 1.625 1.813 1.719 1.500 1.688 1.594 1.375 1.563 1.469 1.250 1.438 1.344 1.125 1.313 1.219 1.000 1.188 1.094 0.875 1.063 0.969 0.750 0.937 0.844 0.625 0.812 0.719 0.500 0.687 0.594 0.375 0.562 0.469 0.250 0.437 0.344 0.000 0.312 0.000
PT2305 V1.1
-6-
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2.5W x 2 Class AB Audio Power Amplifier
PT2305
HEAT DISSIPATION
During normal operation, the chip only consumes very little stand-by current. In high output power conditions, the package temperature will rise. For proper operating temperature, a modest heat sink mounted on the top side of the chip is required. The thermal resistance requirement of the heat sink demand may be obtained by the formula below: JA = (TJ(max) - TA) / PDISS PDISS = IC dissipation power TJ (max) = Maximum chip conjunction temperature TA = external environment temperature JA = thermal resistance from chip conjunction to ambience environment With 60% estimated efficiency (eff), PT2305 in 2W + 2W output power dissipation is probably PDISS = ( Po / eff ) - Po = 2.6W The maximum chip conjunction temperature is 150C. Exceeding this temperature will damage the chip, assuming the outside environment air temperature is 50C. From the chip conjunction dissipation to external environment thermal resistance JA should be: JA = ( 150 - 50 ) / 2.6 = 38.4/W The PT2305 chip conjunction to case thermal resistance JC is 26 /W. Therefore the heat sink thermal resistance should be: JA -JC = 12.4/W In normal operating, no need extra heat sink, only utilize the ground (copper foil) of PCB to heat dissipation.
PT2305 V1.1
-7-
May, 2005
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2.5W x 2 Class AB Audio Power Amplifier
PT2305
ABSOLUTE MAXIMUM RATINGS
Parameter Symbol Min. Max. Supply voltage VDD 7 Operating temperature Topr -40 +85 Storage temperature Tstg -65 +150 Maximum input voltage Vimax -0.3 VDD +0.3 Maximum input current Iimax -10 +10 * Input pins surge current can reach 100mA does not induce the CMOS latched up. Unit V V mA
PT2305 V1.1
-8-
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2.5W x 2 Class AB Audio Power Amplifier
PT2305
ELECTRICAL CHARACTERISTICS
(Unless otherwise, Vcc=5V, bandwidth=22 ~ 22KHz) Parameter Symbol Conditions Supply voltage VDD Vin=0V Operating current Is Vshutdown=VDD Two channels gain error Gerr RIN=RF=20K Po=1W, RL=8 THD+N THD Po=340mW, RL=32 THD=1%, RL=3 THD=1%, RL=4 THD=10%, RL=4 Power output Po THD=1%, RL=8 THD=10%, RL=8 Pout=1.1W, RL=8, Signal-to-noise ratio SNR A-Weighted Residual noise Vno A-Weighted Output offset Voff Vin=0V, +OUT ~ -OUT Channel separation CS F=1KHz Power supply CB=1.0F, f=120Hz PSRR rejection ratio VRIPPLE=200mVrms: RL= 8 DC Vol=5V F=1KHz Volume control range Vatt DC Vol=0V Volume setup step Gstep Vatt=0 ~ -51dB Mute mute DC Vol=0V Overheat close TSSOP Back to work Temperature protect TH Overheat close SOP Back to work Shutdown on Shutdown voltage VSD Shutdown off Mute on Mute voltage VMT Mute off Min. 2.7 1.0 25 -0.75 -75 -78 0.5 0.5 Typ. 5 15 0.7 0 0.3 1 2.2 2 2.5 1.1 1.5 93 40 10 70 74 0 -78 0 150 105 135 105 0.6 0.2 0.6 0.2 Max. Unit 6 V 30 mA 2.0 A 1 dB % W 50 50 dB V mV dB dB
+0.75 dB 1 dB dB VDD 0.3 VDD 0.3
PT2305 V1.1
-9-
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2.5W x 2 Class AB Audio Power Amplifier
PT2305
PACKAGE THERMAL CHARACTERISTIC
PACKAGE TYPE: TSSOP, 20PINS, 173MIL
Parameter From chip conjunction dissipation to external environment From chip conjunction dissipation to package surface Symbol JA JC Condition Ta=45 Value 68.66 22.94 Unit /W /W
PACKAGE TYPE: SOP, 20PINS, 300MIL
Parameter From chip conjunction dissipation to external environment From chip conjunction dissipation to package surface Symbol JA JC Condition Ta=45 Value 45.44 27.00 Unit /W /W
PT2305 V1.1
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2.5W x 2 Class AB Audio Power Amplifier
PT2305
TYPICAL PERFORMANCE CHARACTERISTICS
THD+N vs Output Power
THD+N vs Output Power
THD+N vs Output Power
THD+N vs Output Power
THD+N vs Output Power
PT2305 V1.1 - 11 -
THD+N vs Output Power
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2.5W x 2 Class AB Audio Power Amplifier
PT2305
THD+N vs Output Power
THD+N vs Frequency
THD+N vs Frequency
THD+N vs Frequency
THD+N vs Frequency
THD+N vs Frequency
PT2305 V1.1
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2.5W x 2 Class AB Audio Power Amplifier
PT2305
THD+N vs Output Power
THD+N vs Frequency
Output Power vs Load Resistance
Output Power vs Load Resistance
Power Supply Rejection Ratio
PT2305 V1.1 - 13 -
Dropout Voltage
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2.5W x 2 Class AB Audio Power Amplifier
PT2305
Volume Control Characteristics
Power Dissipation vs Output Power
2.25 2 1.75 1.5 1.25 1 0.75 0.5 0.25 0
Frequency(Hz)
2.5
3
3.5
4
4.5
5
5.5
SUPPLY VOLTAGE(V)
Crosstalk
15 12.5 10 7.5 5 2.5 0 2.5 3 3.5 4 4.5 5 5.5
Output Power vs Supply Voltage
SUPPLY VOLTAGE(V)
Supply Current vs Supply Voltage
Power Dissipation vs Output Power
PT2305 V1.1
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2.5W x 2 Class AB Audio Power Amplifier
PT2305
APPLICATION CIRCUIT
5V
+
10 F
0.1 F
CH 1
1 2 3 4 5 6 7
10 4 DC Volu me C ontr ol
Bypass GND -Out 1 VD D +Out 1 GND
GND GND -OUT 2 VD D
20 19 18 17 16 15 14 13 12 11
20 K 20 K 33 4 20 K 20 K 33 4
CH 2
P T 23 0 5
+Out 2 GND Vo 2 Vin 2 Vin 1 Vo 1
C H 2 -i n
Shutdown Mute VD D DC_Vol
8 9 10 +
1 F
C H 1 -i n
PT2305 V1.1
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2.5W x 2 Class AB Audio Power Amplifier
PT2305
ORDER INFORMATION
Valid Part Number PT2305 PT2305-HT PT2305-S PT2305-D Package Type 20 Pins, TSSOP, 173mil 20 Pins, HTSSOP, 173mil 20 Pins, SOP, 300mil 20 Pins, DIP, 300mil Top Code PT2305 PT2305-HT PT2305-S PT2305-D
PT2305 V1.1
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2.5W x 2 Class AB Audio Power Amplifier
PT2305
PACKAGE INFORAMTION
20PINS, TSSOP, 173MIL
PT2305 V1.1
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2.5W x 2 Class AB Audio Power Amplifier
PT2305
Symbols A A1 A2 b b1 c c1 D E E1 e L L1 R R1 S 1 2 3
Min. 0.05 0.80 0.19 0.19 0.09 0.09 6.40 4.30 0.45 0.09 0.09 0.20 0
Nom. 1.00 0.22 6.50 6.40 BSC. 4.40 0.65 BSC. 0.60 1.00 REF. 12 REF. 12 REF.
Max. 1.20 0.15 1.05 0.30 0.25 0.20 0.16 6.60 4.50 0.75 8
PT2305 V1.1
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2.5W x 2 Class AB Audio Power Amplifier
PT2305
Notes: 1. Dimensioning and tolerancing per ASME Y14.5M-1994. 2. Controlling Dimension: Millimeters 3. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15 per end. 4. Dimension E1 does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.25 per side. 5. Dimension b does not include dambar protrusion. Allowable dambar protrusion shall be 0.08 mm total in excess of the b dimension at maximum material condition. Dambar cannot be located on the lower radius or the foot. Minimum space between protrusion and adjacent lead is 0.07 mm. 6. N is the maximum number of terminal positions for the specified package length. Depopulation is allowed, but only under the following conditions: - Depopulation may reduce N by increments of four leads only. - Only end leads may be removed. - Leads must be symmetrically arranged with respect to datum A (Note 10) to avoid any array shifting. 7. Terminal numbers are shown for reference only. 8. Datum A and B to be determined at datum plane H. 9. Dimensions D and E1 to be determined at datum plane H. 10. This dimension applies only to variations with an even number of leads per side. For variations with an odd number of leads per side, the center lead must be coincident with the package centerline, datum A. 11. Cross section B-B to be determined at 0.10 to 0.25 mm from the lead tip. 12. Details of the pin 1 identifier are optional, but must be located within the zone indicated. 13. D1 and E2 minimum dimensions of thermally enhanced types are variables depending on device function (die paddle size). D1 and E2 maximum dimensions can be equal to D/E1 maximum dimensions. End user should verify actual size of exposed thermal pad for specific device application. 14. A1 is defined as the vertical distance from the seating plane to the lowest point on the package body excluding the lid and or thermal enhancement on cavity down package configurations. 15. Caution should be taken during design, assembly and processing to prevent deposited board solder from holding the leads up off the board. This is applicable to thermal enhanced variations where A1 dimension is allowed to be zero. 16. Refer to JEDEC MO-153 Variation AC JEDEC is the trademark of JEDEC SOLID STATE TECHNOLOGY ASSOCIATION
PT2305 V1.1
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2.5W x 2 Class AB Audio Power Amplifier
PT2305
20 PINS, HTSSOP, 173MIL
PT2305 V1.1
- 20 -
May, 2005
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2.5W x 2 Class AB Audio Power Amplifier
PT2305
PT2305 V1.1
- 21 -
May, 2005
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2.5W x 2 Class AB Audio Power Amplifier
Symbols A A1 A2 b b1 c c1 D D1 E E1 E2 e L L1 R R1 S 1 2 3 Min. 0.05 0.80 0.19 0.19 0.09 0.09 6.40 2.20 4.30 1.50 0.45 0.09 0.09 0.20 0 Nom. 1.00 0.22 6.50 6.40 BSC. 4.40 0.65 BSC. 0.60 1.00 REF. 12 REF. 12 REF. Max. 1.20 0.15 1.05 0.30 0.25 0.20 0.16 6.60 4.50 0.75 8
PT2305
PT2305 V1.1
- 22 -
May, 2005
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2.5W x 2 Class AB Audio Power Amplifier
PT2305
Notes: 1. Dimensioning and tolerancing per ASME Y14.5M-1994. 2. Controlling Dimension: Millimeters 3. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15 per end. 4. Dimension E1 does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.25 per side. 5. Dimension b does not include dambar protrusion. Allowable dambar protrusion shall be 0.08 mm total in excess of the b dimension at maximum material condition. Dambar cannot be located on the lower radius or the foot. Minimum space between protrusion and adjacent lead is 0.07 mm. 6. N is the maximum number of terminal positions for the specified package length. Depopulation is allowed, but only under the following conditions: - Depopulation may reduce N by increments of four leads only. - Only end leads may be removed. - Leads must be symmetrically arranged with respect to datum A (Note 10) to avoid any array shifting. 7. Terminal numbers are shown for reference only. 8. Datum A and B to be determined at datum plane H. 9. Dimensions D and E1 to be determined at datum plane H. 10. This dimension applies only to variations with an even number of leads per side. For variations with an odd number of leads per side, the center lead must be coincident with the package centerline, datum A. 11. Cross section B-B to be determined at 0.10 to 0.25 mm from the lead tip. 12. Details of the pin 1 identifier are optional, but must be located within the zone indicated. 13. D1 and E2 minimum dimensions of thermally enhanced types are variables depending on device function (die paddle size). D1 and E2 maximum dimensions can be equal to D/E1 maximum dimensions. End user should verify actual size of exposed thermal pad for specific device application. 14. A1 is defined as the vertical distance from the seating plane to the lowest point on the package body excluding the lid and or thermal enhancement on cavity down package configurations. 15. Caution should be taken during design, assembly and processing to prevent deposited board solder from holding the leads up off the board. This is applicable to thermal enhanced variations where A1 dimension is allowed to be zero. 16. Refer to JEDEC MO-153 Variation ACT JEDEC is the trademark of JEDEC SOLID STATE TECHNOLOGY ASSOCIATION
PT2305 V1.1
- 23 -
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2.5W x 2 Class AB Audio Power Amplifier
PT2305
20 PINS, SOP, 300MIL
Symbol A A1 B C D E e H h L
Min. 2.35 0.10 0.33 0.23 12.60 7.40 10.00 0.25 0.40 0
Nom.
Max. 2.65 0.30 0.51 0.32 13.00 7.60 10.65 0.75 1.27 8
1.27 bsc.
PT2305 V1.1
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2.5W x 2 Class AB Audio Power Amplifier
PT2305
Notes: 1. Dimensioning and tolerancing per ANSI Y14.5M-1982. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold Flash, protrusion or gate burrs shall not exceed 0.15 mm (0.006 in) per side. 3. Dimension "E" does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25 mm (0.010 in) per side. 4. The chamfer on the body is optional. It is not present, a visual index feature must be located within the crosshatched area. 5. "L" is the length of the terminal for soldering to a substrate. 6. N is the number of the terminal positions (N=20) 7. The lead width "B" as measured 0.36 mm (0.014 in) or greater above the seating plane, shall not exceed a maximum value of 0.61 mm (0.24 in). 8. Controlling dimension: MILLIMETER. 9. Refer to JEDEC MS-013, Variation AC. JEDEC is the trademark of JEDEC SOLID STATE TECHNOLOGY ASSOCIATION.
PT2305 V1.1
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2.5W x 2 Class AB Audio Power Amplifier
PT2305
20PINS, DIP, 300 MIL
PT2305 V1.1
- 26 -
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2.5W x 2 Class AB Audio Power Amplifier
Symbol A A1 A2 b b1 b2 b3 c c1 D D1 E E1 e eA eB eC L Min. 0.015 0.115 0.014 0.014 0.045 0.030 0.008 0.008 0.980 0.005 0.300 0.240 0.000 0.115 Nom. 0.130 0.018 0.018 0.060 0.039 0.010 0.010 1.030 0.310 0.250 0.100 bsc. 0.300 bsc. 0.130 Max. 0.210 0.195 0.022 0.020 0.070 0.045 0.014 0.011 1.060 0.325 0.280 0.430 0.060 0.150
PT2305
Notes: 1. All dimensions are in INCHES. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension "A""A1" and "L" are measured with the package seated in JEDEC Seating Plane Gauge GS-3 4. "D""D1" and "E1" dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch. 5. "E" and "eA" measured with the leads constrained to be perpendicular to datum -c- . 6. "eB" and "eC" are measured at the lead tips with the leads unconstrained. 7. N is the number of the terminal positions (N=20) 8. Pointed or rounded lead tips are preferred to ease insertion. 9. "b2" and "b3" maximum dimensions are not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm) 10. Distance between leads including dambar protrusions to be 0.005 inch minimum. 11. Datum plane -H- coincident with the bottom of lead, where lead exits body. 12. Refer to JEDEC MS-001, Variation AD. JEDEC is the trademark of JEDEC SOLID STATE TECHNOLOGY ASSOCIATION.
PT2305 V1.1
- 27 -
May, 2005


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